SC Duplex 2.0/3.0mm UPC/APC Hybrid Multimode

The SC Duplex Connector series is a versatile, small-form-factor solution designed for both Single-mode (OS2) and Multimode (OM1/OM2/OM3/OM4) applications. Supporting both 2.0mm and 3.0mm cable diameters, these connectors utilize a push-pull coupling mechanism for rapid deployment and high-density fiber management.

Available in UPC (Ultra Physical Contact) and APC (Angled Physical Contact) polish types, our SC Duplex connectors are color-coded to international standards (Blue, Green, Aqua, Beige, and Magenta) to ensure error-free patching in complex network environments.

Description

📊 Technical Performance matrix

Parameter Single-mode (UPC/APC) Multimode (OM1-OM4)
Insertion Loss (IL) ≤ 0.20 dB (Typical) ≤ 0.25 dB (Typical)
Return Loss (RL) UPC ≥ 50dB | APC ≥ 60dB ≥ 35 dB
Durability > 1000 Mating Cycles > 1000 Mating Cycles
Tensile Strength ≥ 100N (2.0/3.0mm) ≥ 100N (2.0/3.0mm)
Operating Temp -40°C to +85°C -40°C to +75°C

💡 Application Insights & FAQ

Q: How do the color codes correspond to the fiber types? A: We follow international TIA standards:

  • Blue: Single-mode UPC (OS2)

  • Green: Single-mode APC (OS2)

  • Beige: Multimode (OM1/OM2)

  • Aqua: Multimode (OM3/OM4 10G)

  • Magenta: Multimode (OM4 High-Bandwidth)

Q: Can these connectors be used for hybrid Multimode APC setups? A: While APC is standard for Single-mode, we can provide Multimode APC connectors for specific medical and sensory applications. These are typically custom-ordered through our Manufacturer Direct service.

Q: Is the duplex clip removable? A: Yes. Our SC Duplex connectors feature a high-tension removable clip, allowing the connectors to be used individually as Simplex if required, or re-aligned for polarity correction.

Q: What is the benefit of the 3.0mm boot over the 2.0mm boot? A: The 3.0mm boot is designed for thicker, jacketed patch cables used in harsh environments or vertical rises where higher pulling tension and bend protection are required. The 2.0mm boot is optimized for high-density patching in ODFs.

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